Numerical simulation is a powerful tool to design, analyse and optimize forming processes taking into account thermal, mechanical and metallurgical effects and interactions. At the IFUM, a variety of numerical process simulation issues are addressed in research projects in the fields of sheet metal forming, bulk metal forming, damage modelling and die wear modelling. The focus is on a holistic modelling of the occurring effects and interactions. By using the experience and competence in the field of experimental material characterization, realistic material models can be developed and parameterized. In addition to the process design and prediction of the final component properties, the description of the damage development through the use and further development of suitable models is also considered. Another focus deals with the mechanical and thermal calculation of the die load and wear in order to enable the prediction of the die failure and a subsequent optimisation of the dies based on these calculations.
Numerical simulation is a powerful tool to design, analyse and optimize forming processes taking into account thermal, mechanical and metallurgical effects and interactions. At the IFUM, a variety of numerical process simulation issues are addressed in research projects in the fields of sheet metal forming, bulk metal forming, damage modelling and die wear modelling. The focus is on a holistic modelling of the occurring effects and interactions. By using the experience and competence in the field of experimental material characterization, realistic material models can be developed and parameterized. In addition to the process design and prediction of the final component properties, the description of the damage development through the use and further development of suitable models is also considered. Another focus deals with the mechanical and thermal calculation of the die load and wear in order to enable the prediction of the die failure and a subsequent optimisation of the dies based on these calculations.
